ORIGINAL ARTICLE
Agglomeration of Silicon Dioxide Nanoscale Colloids in Chemical Mechanical Polishing Wastewater: Influence of pH and Coagulant Concentration
1
School of Civil Engineering, Universiti Sains Malaysia, Pulau Pinang, Malaysia
2
Institut de Sciences des Materiaux de Mulhouse, CNRS UMR 7361, France
Online publication date: 2019-12-21
Publication date: 2019-09-01
Civil and Environmental Engineering Reports 2019;29(3):252-271
KEYWORDS
ABSTRACT
Chemical mechanical polishing (CMP) wastewater generated from semiconductor manufacturing industries is known to contain residual organic and inorganic contaminants, i.e. photoresists, acids, including silicon dioxide (SiO2), nanoparticles (NPs) and others. Nanoscale colloids in CMP wastewater have strong inclination to remain in the suspension, leading to high turbidity and chemical oxygen demand (COD). Although various types of pre-treatment have been implemented, these nanoparticles remain diffused in small clusters that pass through the treatment system. Therefore, it is crucial to select suitable pH and coagulant type in the coagulation treatment process. In this research zeta potential and dynamic light scattering measurements are applied as preliminary step aimed at determining optimum pH and coagulant dosage range based on the observation of inter particle-particle behavior in a CMP suspension. The first phase of the conducted study is to analyze nanoscale colloids in the CMP suspension in terms of zeta potential and z-average particle size as a function of pH within a range of 2 to 12. Two types of coagulants were investigated - polyaluminum chloride (PACl) and ferrous sulfate heptahydrate (FeSO4·7H2O). Similar pH analysis was conducted for the coagulants with the same pH range separately. The second phase of the study involved evaluating the interaction between nanoscale colloids and coagulants in the suspension. The dynamics of zeta potential and corresponding particle size were observed as a function of coagulant concentration. Results indicated that CMP wastewater is negatively charged, with average zeta potential of -59.8 mV and 149 d.nm at pH value of 8.7. The interaction between CMP wastewater and PACl showed that positively charged PACl rapidly adsorbed colloids in the wastewater, reducing the negative surface charge of nanoscale clusters. The interaction between CMP wastewater and FeSO4·7H2O showed that larger dosage is required to aggregate nanoscale clusters, due to its low positive value to counter negative charges of CMP wastewater.
REFERENCES (36)
1.
Aguilar, MI, Saez, J, Llorens, M, Soler, A and Ortuno, JF 2003. Microscopic observation of particle reduction in slaughterhouse wastewater by coagulation-flocculation using ferric sulphate as coagulant and different coagulant aids. Water Research 37, 2233-2241.
2.
Brar, S, Verma, M, Tyagi, R and Surampalli, R 2010. Engineered nanoparticles in wastewater and wastewater sludge – evidence and impacts. Waste Management 30, 504-520.
3.
Chang, FM and Liu, JC 2007. Precipitation removal of fluoride from semiconductor wastewater. Journal of Environmental Engineering 133, 419-425.
4.
Chou, WL, Wang, CT and Chang, SY 2009. Study of COD and turbidity removal from real oxide-CMP wastewater by iron electrocoagulation and the evaluation of specific energy consumption. Journal of Hazardous Materials 168, 1200-1207.
5.
Chuang, TC, Huang, CJ and Liu JC 2002. Treatment of semiconductor wastewater by dissolved air flotation. Journal of Environmental Engineering 12, 974-980.
6.
Decan, N, Wu, D, Williams, A, Bernatchez, S, Johnston, M, Hill, M and Halappanavar, S 2016. Characterization of in vitro genetoxic, cytotoxic and transcriptomic responses following exposures to amorphous silica of different sizes. Mutation Research/Genetic Toxicology and Environmental Mutagenesis 796, 8-22.
7.
De Luna, MDG, Warmadewanthi and Liu, JC 2009. Combined treatment of polishing wastewater and fluoride-containing wastewater from a semiconductor manufacturer. Colloids and Surfaces A: Physicochemical and Engineering Aspects 347, 64-68.
8.
Den, W and Huang, C 2005. Electrocoagulation for removal of silica nanoparticles from chemical-mechanical-planarization wastewater. Colloids and Surfaces A: Physicochemical and Engineering Aspects 254, 81-89.
9.
Drouiche, N, Ghaffour, N, Lounici, H, Mameri, N, Maallemi, A and Mahmoudi, H 2008. Electrochemical treatment of chemical mechanical polishing wastewater: removal of fluoride – sludge characteristics – operating cost. Desalination 223, 134-142.
10.
Higgin, R, Howe, K and Mayer, TM 2010. Synergistic behaviour between silica and alginate: novel approach for removing silica scale from RO membranes. Desalination 250, 76-81.
11.
Hollingsworth, J, Sierra-Alvarez, R, Zhou M, Ogden, KL and Field, JA 2005. Anaerobic biodegradability and methanogenic toxicity of key constituents in copper chemical mechanical planarization effluents of the semiconductor industry. Chemosphere 59, 1219-1228.
12.
Hsu. SC et al. 2011. Tungsten and other heavy metal contamination in aquatic environments receiving wastewater from semiconductor manufacturing. Journal of Hazardous Materials 189, 193-202.
13.
Hu CY, Lo SL, Li CM and Kuan WH 2005. Treating chemical mechanical polishing (CMP) wastewater by electro-coagulation flotation process with surfactant. Journal of Hazardous Materials A120, 15-20.
14.
Huang, CJ, Yang, BM, Chen, KS, Chang, CC and Kao, CM 2011. Application of membrane technology on semiconductor wastewater reclamation: a pilot-scale study. Desalination 278, 203-210.
15.
Huang, H, Liu, J, Zhang, P, Zhang, D and Gao, F 2017. Investigation on the simultaneous removal of fluoride, ammonia nitrogen and phosphate from semiconductor wastewater using chemical precipitation. Chemical Engineering Journal 307, 696-706.
16.
Hunter, RJ 2001. Measuring zeta potential in concentrated industrial slurries. Colloids and Surfaces A: Physicochemical and Engineering Aspects 195, 205-214.
17.
Keller A, Wang H, Zhou D, Lenihan H, Cherr G, Cardinale B, Miller R and Ji Z 2010. Stability and aggregation of metal oxide nanoparticles in natural aqueous matrices, Environmental Science and Technology 44, 1962-1967.
18.
Kim, D, Kim, J, Ryu, HD and Lee, SI 2009. Effect of mixing on spontaneous struvite precipitation from semiconductor wastewater. Bioresource Technology 100, 74-78.
19.
Kuan, WH and Hu, CY 2009. Chemical evidences for the optimal coagulant dosage and pH adjustment of silica removal from chemical mechanical polishing (CMP) wastewater. Colloids and Surfaces A: Physicochemical and Engineering Aspects 342, 1-7.
20.
Lai, C and Lin, S 2003. Electrocoagulation of chemical mechanical polishing (CMP) wastewater from semiconductor fabrication, Chemical Engineering Journal 95, 205-211.
21.
Lai, CL and Lin, SH 2004. Treatment of chemical mechanical polishing wastewater by electrocoagulation: system performances and sludge settling characteristics. Chemosphere 54, 235-242.
22.
Lien, CY and Liu, JC 2006. Treatment of polishing wastewater from semiconductor manufacturer by dispersed air flotation. Journal of Environmental Engineering 132, 51-57.
23.
Lin, SH and Yang, CR 2004. Chemical and physical treatments of chemical mechanical polishing wastewater from semiconductor fabrication. Journal of Hazardous Materials B108, 103-109.
24.
Lin, W, Huang, Y, Zhou, X and Ma, Y 2006. In vitro toxicity of silica nanoparticles in human lung cancer cells. Toxicology and Applied Pharmacology 217, 252-259.
25.
Liu, YH, Lin, CY, Huang, JH and Yen, SC 2016. Particle removal performance and its kinetic behaviour during oxide-CMP wastewater treatment by electrocoagulation. Journal of the Taiwan Institute of Chemical Engineers 60, 520-524.
26.
Lin, SH and Jiang, CD 2003. Fenton oxidation and sequencing batch reactor (SBR) treatments of high-strength semiconductor wastewater. Desalination 154, 107-116.
27.
Lin, SH and Kiang, CD 2003. Combined physical, chemical and biological treatments of wastewater containing organics from a semiconductor plant. Journal of Hazardous Materials B97, 159-171.
28.
Mulloy, K 2003. Silica exposure and systemic vasculitis, Environmental Health Perspectives 111, 1933-1938.
29.
Ryu, HD, Kim, D and Lee, SI 2008. Application of struvite precipitation in treating ammonium nitrogen from semiconductor wastewater. Journal of Hazardous Materials 156, 163-169.
30.
Sheikholeslami, R, Al-Mutaz, IS, Tan, S and Tan, SD 2002. Some aspects of silica polymerization and fouling and its pretreatment by sodium aluminate, lime and soda ash. Desalination 150, 85-92.
31.
Tsai, JC, Kumar, M, Chen, SY and Lin, JG 2007. Nano-bubble flotation technology with coagulation process for the cost-effective treatment of chemical mechanical polishing wastewater. Separation and Purification Technology 58, 61-67.
32.
Wang, CT, Chou, WL, Chen, LS and Chang, SY 2009. Silica particles settling characteristics and removal performances of oxide chemical mechanical polishing wastewater treated by electrocoagulation technology. Journal of Hazardous Materials 161, 344-350.
33.
Yang, GCC and Li, CJ 2007. Electrofiltration of silica nanoparticle-containing wastewater using tubular ceramic membranes. Separation and Purification Technology 58, 159-165.
34.
Yang, GCC, Yang, TY and Tsai, SH 2003. Crossflow electromicrofiltration of oxide-CMP wastewater. Water Research 37, 785-792.
35.
You, SH, Tseng, DH and Guo, GL 2001. A case study on the wastewater reclamation and reuse in the semiconductor industry. Resources, Conservation and Recycling 32, 73-81.
36.
Zhang, Y, Chen Y, Westerhoff, P, Hristovski, K and Crittenden, JC 2008. Stability of commercial metal oxide nanoparticles in water. Water Research 42, 2204-2212.
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| eISSN: | 2450-8594 |
| ISSN: | 2080-5187 |
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