ORIGINAL ARTICLE
Temperature Profiles in a Micro Processor Cooled by Direct Refrigerant Evaporation
1
University of Zielona Gora, Faculty of Building, Architecture and Environmental Engineering, Z. Szafrana st 1. 65-516 Zielona Góra, tel.+48683282571, Poland
2
The State Higher Vocational School in Glogow, Poland
Online publication date: 2016-10-21
Publication date: 2016-09-01
Civil and Environmental Engineering Reports 2016;22(3):111-126
KEYWORDS
ABSTRACT
Ail analytical solution to the equation for cooling of a unit, in the interior of which heat is generated, is presented. For that reason, a simplified non-stationary model for determination of the temperature distribution within the unit, temperature of the contact between unit and a liquid layer, and the evaporating layer thickness in the function of time, is elaborated. A theoretical analysis of the external cooling of the unit, by considering the phenomenon of the liquid evaporation with the use of the Fourier and Poisson’s equations, is given. Both, stationary- and non-stationary description of the cooling are shown. The obtained results of simulation seems to be useful in designing the similar cooling systems. A calculation mode for a cooling systems equipped with the compressor heat pump, as an effective cooling method, is also performed.
REFERENCES (16)
1.
Carslaw H.S., Jaeger J.C.: Conduction of Heat in Solid, Oxford University Press 1959.
2.
Staniszewski B.: Wymiana ciepła - podstawy teoretyczne, PWN Warszawa, 1980 (in Polish).
3.
Talar J., Duda P.: Rozwiązywanie prostych i odwrotnych zagadnień przewodzenia ciepła, Wydawnictwo Naukowo-Techniczne, Warszawa, 2003 (in Polish).
4.
Wang D.G., Muller P.K.: Improving cooling efficiency by increasing fan power usage, Microelectronics Journal 31, 765-771, 2000.
5.
Darabi J.: An electrohydrodynamic polarization micropump for electronic cooling, Journal of Microelectromechanical Systems, 10, 98-105, 2001.
6.
Darbi J., Ekula K.: Development of a chip-integrated micro cooling device, Microelectronics Journal 34, 1067-1074, 2003.
7.
Cunha F. R., Sobral Y.D.: Asymptotic solution for pressure-driven flows of magnetic fluids in pipes, Journal of Magnetism and Magnetic materials 289, 314-317, 2005.
8.
Ramos D.M., Cunha F.R., Sobral Y.D., Fontoura Rodrigues J.L.A.: Computer simulations of magnetic fluids in laminar pipe flows, Journal of Magnetic Materials 289, 238-241, 2005.
9.
Moreau E., Paillat T., Touchard G.: Space charge density in electric and conductive liquids flowing through a glass pipe, Journal of Electrostatics 51-52, 448-454, 2001.
10.
Ribeiro, G. B., Barbosa Jr., J.R., Prata, A.T.: Mini-channel evaporator/heat pipe assembly for a chip cooling vapor compression refrigeration system, IJR 33 ( 2010 ) 1402-1412.
11.
Marcinichen, J. B., Thome, J. R., Bruno, M.: Cooling of microprocessors with micro-evaporation: A novel two-phase cooling cycle, IJR33 ( 2010 ) 1264 - 1276.
12.
Wu, D., Marcinichen, J. B., Thome, J. R.: Experimental evaluation of a controlled hybrid two-phase multi-microchannel cooling and heat recovery system driven by liquid pump and vapor compressor, IJR 36 ( 2013 ) 375-389.
13.
Silvério, V., Cardoso, S., Gaspar, J., Freitas, P. P., Moreira, A.L.N.: Design, fabrication and test of an integrated multi-microchannel heat sink for electronics cooling, Sensors and Actuators A 235 (2015) 14-27.
14.
Marcinichen, J. B., Oliver, J.A., de Olivera, V.,Thome, J.R.: A review of onchip micro-evaporation: Experimental evaluation of liquid pumping and vapor compression driven cooling systems and Control, Applied Energy 92 (2012) 147-161.
15.
Lipnicki Z., Waloryszek D.: Evaporation of the heterogeneous liquid flow forced by the magnetic field over a wall, The 15th Riga and 6th PAMIR Conference on Fundamental and Applied MHD, Liquid metal technologies, 283-286, 2005.
16.
Lipnicki Z., Król F.: Dynamical cooling of semiconductor by contact layer. International Journal of Heat and Mass Transfer 48, 2922-2925, 2005.
Share
RELATED ARTICLE
| eISSN: | 2450-8594 |
| ISSN: | 2080-5187 |
We process personal data collected when visiting the website. The function of obtaining information about users and their behavior is carried out by voluntarily entered information in forms and saving cookies in end devices. Data, including cookies, are used to provide services, improve the user experience and to analyze the traffic in accordance with the Privacy policy. Data are also collected and processed by Google Analytics tool (more).
You can change cookies settings in your browser. Restricted use of cookies in the browser configuration may affect some functionalities of the website.
You can change cookies settings in your browser. Restricted use of cookies in the browser configuration may affect some functionalities of the website.
